2021-Company founded by an international power semiconductor team.

2024-Exhibited wide-bandgap product portfolio at PCIM Europe.
 

2025-Expanded SiC SBD platform and customer qualification activities.

2026-Entered TPEX GISA counseling process; expanded Tier-1 customer design-in and dual-source SiC strategy.

Future-Scale mass production, expand AI power product portfolio and strengthen global market coverage.